DELO-MONOPOX

1-komponents epoxi DELO-MONOPOX är ett en-komponents värmehärdande epoxilim för limning, ingjutning och tätning av fogar. Epoxi lim är ett höghållfast material som kan användas som alternativ till nitning, svetsning och lödning i applikationer som utsätts för hög stress.

Epoxi har utmärkt vidhäftning på metaller, ferriter och keramik. Särskilda fördelar med epoxi jämfört med andra lim är deras motståndskraft mot temperatur, kemikalier och låg vattenabsorption. De skyddar också mot korrosion.

Epoxilimmet levereras färdig att använda utan att blandning krävs. Härdning av sker i 15-75 minuter @ 130-180 grader C, respektive 80- 170°C för de nya mCD limmerna . Produkter finns med allt från låg viskositet, med goda utflytningsegenskaper till mycket högviska som inte vare sig rinner eller flyter ut.

pdf.gif Monopox (Selection chart)  
Product
pdf.gif
Viscosity
[mPas]
Elongation
at tear [%]
Caracteristics Good bonding materials/applications  
1196 290.000 1.4 Epoxy, aluminium filled, high strength bonding, good flow Metal, temperature-resistant plastic, ferrite and ceramic  
1197 Pasty 1.4 Epoxy, aluminium filled, high strength, high run resistance   Metal, temperature-resistant plastic, ferrite and ceramic  
6093 40.000 1.6 Epoxy, unfilled, low water absorption, excellent thermal stability For casting, coating and fixing of components  
6095 50.000 1.2 Epoxy, unfilled, v-low ions content, ideal for electronics   For casting, coating and fixing of components  
AC265 26.000 1.7 Epoxy, unfilled, Anisotropic Conductive, NIAu particles Flip-chip, Smart card and Smart label aplications  
* AC365 40.000 2.4 mCD, Anisotropic Conductive, low temperature curing 80°C   Flip-chip, Smart card and Smart label aplications  
AD066 20.000 2.5 Epoxy, beige, unfilled, fast curing Metal, temperature-resistant plastic and rubber  
AD288 85.000 200 Epoxy, mineral filled, construction adhesive, very flexible   Fixing of components and assembly groups  
AD295 230.000 1.4 Epoxy, leight beige, mineral filled, high strength Metal, temperature-resistant plastic, ferrite and ceramic  
AD298 Pasty 1.4 Epoxy, mineral filled, tough-hard with high static and dynamic capacity   Metal, temperature-resistant plastic, ferrite and ceramic  
AD299 120.000 4 Epoxy, unfilled, construction adhesive, thixotropic Especially good on zinc- and nickel plated surfaces  
AD480 Pasty 1.4 Epoxy, mineral filled, tough-hard with high static and dynamic capacity   Metal, temperature-resistant plastic, ferrite and ceramic  
GE592 108.000 2.8 Anhydride-curing Epoxy, filled, low temperature curing 100°C  Glob-Top chip encapsulation, chip on board  
GE725 6.500 0.5 Anhydride-curing Epoxy, filled, black, low CTE      Fill in Dam&Fill and casting of semiconductors and sensors.  
GE730 9000 0.7 Anhydride-curing epoxi, filled, black, low CTE Glob-Top and casting of semiconductors and sensors.   
GE785 135.000 0.5 Anhydride-curing epoxi, filled, black, low CTE   Dam in Dam&Fill of semiconductors and sensors.  
MG063 180.000 1.0 Epoxy, unfilled, tough-elastic propertiess potting / casting, coating and fixing of components  
MK055 23.000 1.2 Epoxy, unfilled, beige, high-strength bonding   No-flow-underfill for flip-chip with Pd and stud bumps  
MK096 Pasty 2 Epoxy, unfilled, red, fast initial strength Bonding and fixing of SMD components  
* NU355 34.000 4.5 mCD, unfilled, beige, low temperature curing 80°C    No-flow-underfill for flip-chip with Pd and stud bumps  

* mCD is a new material from DELO. It's in the epoxy familly but with some unique features. Very low curing temperature, fast and with a unique "heat pulse" function. It's enough for the whole material to "see" 80°C to start the curing process and it will continue to cure until it's fully cured. Typical aplication is to heat up the component e.g chip to 250 to 350°C and place the heated component onto the substrate with applied adhesive. Initial strength within second/seconds.
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